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英特爾半導體(大連)有限公司

Technology Development Process Engineer (Etch/TFP/CMP/Litho/DEI)

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  • 我要分享
  • 35萬-70萬/年
  • 大連
  • |
  • 3年以上
  • |
  • 碩士
  • |
  • 全職

職位誘惑: 年終獎金,五險一金,福利好,老板nice,年底雙薪,股票期權,免費班車,技能培訓,節日禮物,技術領先,成長空間大

五子棋游戏程序代码 www.jqrog.icu 發布時間: 2019-05-21發布

職位描述

The selected candidates will be responsible for activities covering process, equipment, materials, and operations in their respective areas of expertise, such as Etch/TFP/CMP/Litho/DEI. Examples of scope of work include silicon process improvement and product enhancement, equipment capability evaluation and expansion, and wafer cost reduction. 
Candidates must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization.
 
Responsibilities include:
·       Perform feasibility study and provide module level process solutions to meet desired device specification and process improvement requirements
·        Lead new process experimentation, implementation and high volume manufacturing readiness in the area of expertise
·       Minimum 3 years of direct experiences in TD or related field.
·       Define, select and qualify the equipment platforms to meet quality and output needs of new processes for high volume manufacturing ramp.
 
Education (Desired degree & major)
·       Must have a Master/ PHD in Electrical engineering, Computer engineering, or engineering/science in related field.
 

職位發布者

Intel HR

HR

3天

簡歷處理用時

93%

簡歷及時處理率

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